- Looking for a high performance alternative to the traditional IMS solution?
- Struggling with heat dissipation within your design constraints?
- Trying to simplify the assembly complexity of your thermal management solution?
Thermastrate® design and manufacture a revolutionary new generation of extremely thermally efficient, custom electronic, power substrate and heatsink assemblies. Thermastrate’s products are targeted at electronics applications that require more effective thermal and interconnect solutions than afforded by conventional solutions. Thermastrate’s technology and product solutions dramatically improve heat dissipation and thermal management, optimise performance and reliability and reduce full system assembly costs.
The Thermastrate Advantage
Best-in-class thermal conductivity
True 3D electrical and thermal constructions
Optimised overall installed cost
Technology Overview
Metal heatsink (3D shapes) or substrate formed from Aluminium alloy, coated with patented, ruggedised, oxide layer providing excellent electrical isolation, mechanical compliance and optimised thermal transfer.
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