THERMASTRATE™

Thermastrate™ design and manufacture a revolutionary new generation of extremely thermally efficient, custom electronic, power substrate and heatsink assemblies.

Thermastrate’s products are targeted at high power electronics applications, requiring more effective thermal and interconnect solutions than afforded by conventional solutions. Our technology solutions dramatically improve heat dissipation and thermal management, optimise performance and reliability and reduce full system assembly costs.

Key Features

• Excellent thermal conductivity
• True 3D electrical and thermal constructions
• Optimised overall installed cost

Technology Overview

Metal heatsink (3D shapes) or substrate formed from Aluminium alloy, coated with patented, ruggedised, oxide layer providing excellent electrical isolation, mechanical compliance and optimised thermal transfer.