FLEXITHERM®
FLEXITHERM® is a new and unique patented form of insulated metal substrate, with lower thermal resistance than conventional IMS linked with a flexible power interconnect system that allows multiple substrate/heatsinks and 3D design freedom.
Features & Benefits:
Patented Thermastrate® ceramic coating:
Thermal interfaces removed
Integral flexible interconnections offer max versatility
Excellent thermal performance
Typical substrate thermal impedance: 0.23 ºC.cm²/W*
Circuits can be formed directly on 3D profiles and heatsinks
Integrated power and control