Base Material |
|
| Max. Dimensions |
Standardised on 210 x 297 mm (8.27”
x 11.69”). |
| Thickness (base plate) |
1 to 5 mm. |
| Aluminium Alloys |
5083, 6082 (others available on request). |
| Dielectric Layer |
Proprietary - 20 microns to 35 microns. |
| Dielectric Strength (kV DC) |
1.5 to 3.0 (20 ~ 35 microns). |
| Build |
Single layer Cu, 1oz (35µm)
to 10oz (350µm). |
| Min. Track Width |
1oz = 0.006” (152µm) to
10oz = 0.015” (381µm). |
| Min. Gap / Space |
1oz = 0.007” (178µm) to
10oz = 0.030” (762µm). |
| Cover layer / Soldermask |
PEN / PI film. |
| Bond Line |
Pre-preg material to suit application
requirements, or ultra-thin glue line. |
| |
|
General |
|
| Finishing |
Ni/Au, Ag. |
| Mechanical |
V-scoring and tooling features available. |
| Testing |
Dielectric Stength - ASTM D149 (IEC
60423-1). |
| |
Visual inspection. |
Please contact us if your application requires other design features
or material types.
