LEDS
Unleashing the power of HB LEDs
Delivering thermal conductivity of up to 140W/mK with integrated interconnects and Direct-to-Heatsink solutions, Thermastrate’s flexitherm® and ultratherm® products give best-in-class thermal impedance and remove thermal barriers to guarantee higher performance of your HB LED assemblies. With thermal conductivity up to 3 times higher than conventional MCPCBs and the optional integrated flexible interconnection tail, Thermastrate’s technologies offer significant advantages over existing solutions. Furthermore as well as being produced on flat plate Aluminum they can also be applied to 3D heatsinks in the form of extrusions and castings, thereby removing the need for TIMs, reducing assembly cost and eliminating thermal barriers between the components and the heatsink.
Features & Benefits
Thermastrate’s technology enables optimized thermal management which results in reduced device junction temperatures, improved lifetimes, performance and system reliability. Performance benefits include higher drive currents, Improved brightness and colour control & stability. The ability to form circuits on non-planar substrates and heatsinks results in simplified construction and assembly costs together with added functionality.
Examples/ Case studies/ Potential applications
Power LED assemblies
Auto - rear light clusters, wing mirror indicator modules, head light light clusters, fog lights, emergency vehicle, train lighting, signal lighting
Highways - traffic lights, road signs
Airport lighting
Marine lighting
Architectural lighting
