ULTRATHERM®
ULTRATHERM® is a new, unique, patented form of insulated metal substrate with less than one third the thermal resistance of conventional IMS and the ability to withstand harsh, high temperature environments in excess of 200°C. Unlike conventional IMS, there is no glue line or dielectric between the copper circuitry and the aluminium substrate.
Features & Benefits:
Patented Thermastrate® ceramic coating:
Thermal interfaces removed
No glue line or prepreg / dielectric
Class leading thermal performance
Typical substrate thermal impedance: 0.14 ºC.cm²/W*
Circuits can be formed directly on 3D profiles and heatsinks
Applications for Ultratherm®
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Design Rules
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Datasheet
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