Base Material |
|
| Max. Dimensions |
Standardised on 210 x 297 mm (8.27” x 11.69”). |
| Thickness (base plate) |
1 to 5 mm. |
| Aluminium Alloys |
5083, 6082 (others available on request). |
| Dielectric Layer |
Proprietary - 20 microns to 35 microns. |
| Dielectric Strength (kV DC) |
1.5 to 3.0 (20 ~ 35 microns). |
| Build |
Plated Cu, 1oz to 10oz. |
| Min. Track Width |
1oz = 0.006” (152µm) to 10oz = 0.015”
(381µm). |
| Min. Gap / Space |
1oz = 0.007” (178µm) to 10oz = 0.030”
(762µm). |
| Soldermask |
Liquid photo-imageable. |
| Bond Line |
None (only dielectric layer exists). |
| |
|
General |
|
| Finishing |
Ni/Au, Ag. |
| Mechanical |
V-scoring and tooling features available. |
| Testing |
Dielectric Stength - ASTM D149 (IEC 60423-1). |
| |
Visual inspection. |
Please contact us if your application requires
other design features or material types.
